No Flow Underfill Assembly Process Development for Fine Pitch Flip Chip Silicon to Silicon Wafer Level Integration: Fid-Bau Portal

No Flow Underfill Assembly Process Development for Fine Pitch Flip Chip Silicon to Silicon Wafer Level Integration

Li, Z. / Lee, S. / Lewis, B.J. / Houston, P.N. / Baldwin, D.F. / Stout, E.A. / Tessier, T.G. / Evans, J.L.

Access

Page navigation

Export, share and cite

No Flow Underfill Assembly Process Development for Fine Pitch Flip Chip Silicon to Silicon Wafer Level Integration

Li, Z. / Lee, S. / Lewis, B.J. / Houston, P.N. / Baldwin, D.F. / Stout, E.A. / Tessier, T.G. / Evans, J.L.

No Flow Underfill Assembly Process Development for Fine Pitch Flip Chip Silicon to Silicon Wafer Level Integration

Li, Z. / Lee, S. / Lewis, B.J. / Houston, P.N. / Baldwin, D.F. / Stout, E.A. / Tessier, T.G. / Evans, J.L.

Access

Page navigation

Export, share and cite

Document information

Title:

No Flow Underfill Assembly Process Development for Fine Pitch Flip Chip Silicon to Silicon Wafer Level Integration

Contributors:

Li, Z. (author) / Lee, S. (author) / Lewis, B.J. (author) / Houston, P.N. (author) / Baldwin, D.F. (author) / Stout, E.A. (author) / Tessier, T.G. (author) / Evans, J.L. (author)

Published in:

ADVANCING MICROELECTRONICS ; 37 ; 20-25

Publication date:

2010-01-01

Size:

6 pages

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.381

Boyle, F. / Eichstadt, D. | British Library Online Contents | 2005

Miquel, B. | British Library Online Contents | 2002

Zoba, D. | British Library Online Contents | 1996

Shen, Y. K. / Lin, P. T. / Yeh, S. W. | British Library Online Contents | 2006

Park, C. E. / Han, B. J. / Bair, H. E. et al. | British Library Online Contents | 1997