Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    A Reliability Study of Nanoparticles Reinforced Composite Lead-Free Solder

    New search for: Chen, S.
    New search for: Zhang, L.
    New search for: Liu, J.
    New search for: Gao, Y.
    New search for: Zhai, Q.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    A Reliability Study of Nanoparticles Reinforced Composite Lead-Free Solder

    New search for: Chen, S.
    New search for: Zhang, L.
    New search for: Liu, J.
    New search for: Gao, Y.
    New search for: Zhai, Q.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    A Reliability Study of Nanoparticles Reinforced Composite Lead-Free Solder

    New search for: Chen, S.
    New search for: Zhang, L.
    New search for: Liu, J.
    New search for: Gao, Y.
    New search for: Zhai, Q.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    A Reliability Study of Nanoparticles Reinforced Composite Lead-Free Solder

    Contributors:

    Chen, S. (author) / Zhang, L. (author) / Liu, J. (author) / Gao, Y. (author) / Zhai, Q. (author)

    Published in:

    MATERIALS TRANSACTIONS ; 51 ; 1720-1726

    Publication date:

    2010-01-01

    Size:

    7 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Thermo-migration behavior of SAC305 lead-free solder reinforced with fullerene nanoparticles

    Chen, G. / Liu, L. / Du, J. et al. | British Library Online Contents | 2016

    Reliability of Sn-Ag-Sb lead-free solder joints

    Lee, H. T. / Lin, H. S. / Lee, C. S. et al. | British Library Online Contents | 2005

    Creep and thermomechanical fatigue properties of in situ Cu6Sn5 reinforced lead-free composite solder

    Tai, F. / Guo, F. / Han, M. T. et al. | British Library Online Contents | 2010

    Vibration Fatigue Reliability of Lead and Lead-Free Solder Joint by FORM/SORM

    Lee, O. S. / Hur, M. J. / Park, Y. C. et al. | British Library Online Contents | 2007

    Evaluation of lead-free solder reliability under vibration at elevated temperature

    Ko, Yong-Ho / Yoo, Sehoon / Lee, Chang-Woo | British Library Online Contents | 2014

    Back to top