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    Evaluation of lead-free solder reliability under vibration at elevated temperature

    New search for: Ko, Yong-Ho
    New search for: Yoo, Sehoon
    New search for: Lee, Chang-Woo

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    Evaluation of lead-free solder reliability under vibration at elevated temperature

    New search for: Ko, Yong-Ho
    New search for: Yoo, Sehoon
    New search for: Lee, Chang-Woo

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Evaluation of lead-free solder reliability under vibration at elevated temperature

    New search for: Ko, Yong-Ho
    New search for: Yoo, Sehoon
    New search for: Lee, Chang-Woo

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Evaluation of lead-free solder reliability under vibration at elevated temperature

    Contributors:

    Ko, Yong-Ho (author) / Yoo, Sehoon (author) / Lee, Chang-Woo (author)

    Published in:

    International journal of materials and structural integrity ; 8 ; 53-61

    Publication date:

    2014-01-01

    Size:

    9 pages

    ISSN:

    1745-0055

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.112

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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