Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Creep and thermomechanical fatigue properties of in situ Cu6Sn5 reinforced lead-free composite solder

    New search for: Tai, F.
    New search for: Guo, F.
    New search for: Han, M. T.
    New search for: Xia, Z. D.
    New search for: Lei, Y. P.
    New search for: Shi, Y. W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Creep and thermomechanical fatigue properties of in situ Cu6Sn5 reinforced lead-free composite solder

    New search for: Tai, F.
    New search for: Guo, F.
    New search for: Han, M. T.
    New search for: Xia, Z. D.
    New search for: Lei, Y. P.
    New search for: Shi, Y. W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Creep and thermomechanical fatigue properties of in situ Cu6Sn5 reinforced lead-free composite solder

    New search for: Tai, F.
    New search for: Guo, F.
    New search for: Han, M. T.
    New search for: Xia, Z. D.
    New search for: Lei, Y. P.
    New search for: Shi, Y. W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Creep and thermomechanical fatigue properties of in situ Cu6Sn5 reinforced lead-free composite solder

    Contributors:

    Tai, F. (author) / Guo, F. (author) / Han, M. T. (author) / Xia, Z. D. (author) / Lei, Y. P. (author) / Shi, Y. W. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 527 ; 3335-3342

    Publication date:

    2010-01-01

    Size:

    8 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Epitaxial growth of Cu6Sn5 formed at Sn-based lead-free solder/non-textured polycrystalline Cu plate interface

    Tsukamoto, H. / Nishimura, T. / Nogita, K. | British Library Online Contents | 2009

    Quantification of creep strain distribution in small crept lead-free in-situ composite and non composite solder joints

    McDougall, J. / Choi, S. / Bieler, T. R. et al. | British Library Online Contents | 2000

    A Reliability Study of Nanoparticles Reinforced Composite Lead-Free Solder

    Chen, S. / Zhang, L. / Liu, J. et al. | British Library Online Contents | 2010

    Creep-fatigue crack propagation in lead-free solder under cyclic loading with various waveforms

    Tanaka, K. | British Library Online Contents | 2010

    Effects of nanoscale Cu6Sn5 particles addition on microstructure and properties of SnBi solder alloys

    Li, Xuezheng / Ma, Yong / Zhou, Wei et al. | British Library Online Contents | 2017

    Back to top