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Hybrid Interconnection Process Using Solderable ICAs (Isotropic Conductive Adhesives) with Low-Melting-Point Alloy Fillers
Hybrid Interconnection Process Using Solderable ICAs (Isotropic Conductive Adhesives) with Low-Melting-Point Alloy Fillers
Hybrid Interconnection Process Using Solderable ICAs (Isotropic Conductive Adhesives) with Low-Melting-Point Alloy Fillers
Yim, B.-S. (author) / Kim, J.-M. (author) / Jeon, S.-H. (author) / Lee, S.H. (author) / Kim, J. (author) / Han, J.-G. (author) / Cho, M. (author)
MATERIALS TRANSACTIONS ; 50 ; 2649-2655
2009-01-01
7 pages
Article (Journal)
English
DDC:
620.11
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