Reliability Properties of Solderable Conductive Adhesives with Low-Melting-Point Alloy Fillers: Fid-Bau Portal

Reliability Properties of Solderable Conductive Adhesives with Low-Melting-Point Alloy Fillers

Yim, B.-S. / Lee, J.I. / Heo, Y. / Kim, J. / Lee, S.H. / Shin, Y.-E. / Kim, J.-M.

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Reliability Properties of Solderable Conductive Adhesives with Low-Melting-Point Alloy Fillers

Yim, B.-S. / Lee, J.I. / Heo, Y. / Kim, J. / Lee, S.H. / Shin, Y.-E. / Kim, J.-M.

Reliability Properties of Solderable Conductive Adhesives with Low-Melting-Point Alloy Fillers

Yim, B.-S. / Lee, J.I. / Heo, Y. / Kim, J. / Lee, S.H. / Shin, Y.-E. / Kim, J.-M.

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Check availability in my library

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Document information

Title:

Reliability Properties of Solderable Conductive Adhesives with Low-Melting-Point Alloy Fillers

Contributors:

Yim, B.-S. (author) / Lee, J.I. (author) / Heo, Y. (author) / Kim, J. (author) / Lee, S.H. (author) / Shin, Y.-E. (author) / Kim, J.-M. (author)

Published in:

MATERIALS TRANSACTIONS ; 53 ; 2104-2110

Publication date:

2012-01-01

Size:

7 pages

ISSN:

1345-9678

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

Yim, B.-S. / Kim, J.-M. / Jeon, S.-H. et al. | British Library Online Contents | 2009

New Electrically Conductive Adhesives Filled with Low-Melting-Point Alloy Fillers

Kim, J.-M. / Yasuda, K. / Rito, M. et al. | British Library Online Contents | 2004

Coalescence Characteristics of Fusible Particles in Solderable Isotropic Conductive Adhesives (ICAs)

Lee, S.H. / Lee, J.H. / Lee, J.W. et al. | British Library Online Contents | 2008

An Investigation on Wetting Characteristics of Solder Particle for Solderable Electrically Conductive Adhesives (ECAs)

Kim, J.M. / Yang, K.C. / Lee, S.B. et al. | British Library Online Contents | 2008

Characteristics of Graphene-Filled Solderable Isotropically Conductive Adhesive (ICA)

Yim, B.-S. / Oh, S.-H. / Kim, J. et al. | British Library Online Contents | 2012