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    Effects of the ultrasonic flexural vibration on the interaction between the abrasive particles; pad and sapphire substrate during chemical mechanical polishing (CMP)

    New search for: Xu, W.
    New search for: Lu, X.
    New search for: Pan, G.
    New search for: Lei, Y.
    New search for: Luo, J.

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    Effects of the ultrasonic flexural vibration on the interaction between the abrasive particles; pad and sapphire substrate during chemical mechanical polishing (CMP)

    New search for: Xu, W.
    New search for: Lu, X.
    New search for: Pan, G.
    New search for: Lei, Y.
    New search for: Luo, J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effects of the ultrasonic flexural vibration on the interaction between the abrasive particles; pad and sapphire substrate during chemical mechanical polishing (CMP)

    New search for: Xu, W.
    New search for: Lu, X.
    New search for: Pan, G.
    New search for: Lei, Y.
    New search for: Luo, J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Effects of the ultrasonic flexural vibration on the interaction between the abrasive particles; pad and sapphire substrate during chemical mechanical polishing (CMP)

    Contributors:

    Xu, W. (author) / Lu, X. (author) / Pan, G. (author) / Lei, Y. (author) / Luo, J. (author)

    Published in:

    APPLIED SURFACE SCIENCE ; 257 ; 2905-2911

    Publication date:

    2011-01-01

    Size:

    7 pages

    ISSN:

    0169-4332

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.35

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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