A platform for research: civil engineering, architecture and urbanism
Interfacial Reactions Between Sn-58 mass%Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate
Interfacial Reactions Between Sn-58 mass%Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate
Interfacial Reactions Between Sn-58 mass%Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate
Yoon, J.-W. (author) / Lee, C.-B. (author) / Jung, S.-B. (author)
MATERIALS TRANSACTIONS ; 43 ; 1821-1826
2002-01-01
6 pages
Article (Journal)
English
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Interfacial reactions between eutectic Sn–Pb solder and Co substrate
British Library Online Contents | 2011
|British Library Online Contents | 2004
|British Library Online Contents | 2012
|British Library Online Contents | 2008
|Effect of Zn Addition on Interfacial Reactions Between Sn-Bi Solder and Cu Substrate
British Library Online Contents | 2016
|