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    Oblique Ion Etching for Copper at Elevated Temperature

    New search for: Hino, T.
    New search for: Kobayashi, T.
    New search for: Yamauchi, Y.
    New search for: Nobuta, Y.
    New search for: Nishikawa, M.
    New search for: Mamalis, A.G.
    New search for: Enokizono, M.
    New search for: Kladas, A.

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    Oblique Ion Etching for Copper at Elevated Temperature

    New search for: Hino, T.
    New search for: Kobayashi, T.
    New search for: Yamauchi, Y.
    New search for: Nobuta, Y.
    New search for: Nishikawa, M.
    New search for: Mamalis, A.G.
    New search for: Enokizono, M.
    New search for: Kladas, A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Oblique Ion Etching for Copper at Elevated Temperature

    New search for: Hino, T.
    New search for: Kobayashi, T.
    New search for: Yamauchi, Y.
    New search for: Nobuta, Y.
    New search for: Nishikawa, M.
    New search for: Mamalis, A.G.
    New search for: Enokizono, M.
    New search for: Kladas, A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Oblique Ion Etching for Copper at Elevated Temperature

    Contributors:

    Hino, T. (author) / Kobayashi, T. (author) / Yamauchi, Y. (author) / Nobuta, Y. (author) / Nishikawa, M. (author) / Mamalis, A.G. / Enokizono, M. / Kladas, A.

    Published in:

    Applied Electromagnetic Engineering for Magnetic, Superconducting and Nanomaterials ; 131-136

    MATERIALS SCIENCE FORUM ; 670

    Publication date:

    2011-01-01

    Size:

    6 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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