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    Reliability and Simulation of Lead-Free Solder Joint Behavior in 3D Packaging Structure

    New search for: Nicak, M.
    New search for: Svecova, O.
    New search for: Pulec, J.
    New search for: Sandera, J.
    New search for: Szendiuch, I.
    New search for: Sandera, P.

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    Reliability and Simulation of Lead-Free Solder Joint Behavior in 3D Packaging Structure

    New search for: Nicak, M.
    New search for: Svecova, O.
    New search for: Pulec, J.
    New search for: Sandera, J.
    New search for: Szendiuch, I.
    New search for: Sandera, P.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Reliability and Simulation of Lead-Free Solder Joint Behavior in 3D Packaging Structure

    New search for: Nicak, M.
    New search for: Svecova, O.
    New search for: Pulec, J.
    New search for: Sandera, J.
    New search for: Szendiuch, I.
    New search for: Sandera, P.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Reliability and Simulation of Lead-Free Solder Joint Behavior in 3D Packaging Structure

    Contributors:

    Nicak, M. (author) / Svecova, O. (author) / Pulec, J. (author) / Sandera, J. (author) / Szendiuch, I. (author) / Sandera, P.

    Published in:

    Materials Structure & Micromechanics of Fracture ; 491-494

    KEY ENGINEERING MATERIALS ; 465

    Publication date:

    2011-01-01

    Size:

    4 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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