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    Residual stress analysis on silicon wafer surface layers induced by ultra-precision grinding

    New search for: Zhang, Y.
    New search for: Wang, D.
    New search for: Gao, W.
    New search for: Kang, R.

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    Residual stress analysis on silicon wafer surface layers induced by ultra-precision grinding

    New search for: Zhang, Y.
    New search for: Wang, D.
    New search for: Gao, W.
    New search for: Kang, R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Residual stress analysis on silicon wafer surface layers induced by ultra-precision grinding

    New search for: Zhang, Y.
    New search for: Wang, D.
    New search for: Gao, W.
    New search for: Kang, R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    Residual stress analysis on silicon wafer surface layers induced by ultra-precision grinding

    Contributors:

    Zhang, Y. (author) / Wang, D. (author) / Gao, W. (author) / Kang, R. (author)

    Published in:

    RARE METALS -BEIJING- ENGLISH EDITION ; 30 ; 278-281

    Publication date:

    2011-01-01

    Size:

    4 pages

    ISSN:

    1001-0521

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  669

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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