Effect of interface layer on growth behavior of atomic-layer-deposited Ir thin film as novel Cu diffusion barrier: Fid-Bau Portal

Effect of interface layer on growth behavior of atomic-layer-deposited Ir thin film as novel Cu diffusion barrier

Choi, B. H. / Lee, J. H. / Lee, H. K. / Kim, J. H.

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Effect of interface layer on growth behavior of atomic-layer-deposited Ir thin film as novel Cu diffusion barrier

Choi, B. H. / Lee, J. H. / Lee, H. K. / Kim, J. H.

Effect of interface layer on growth behavior of atomic-layer-deposited Ir thin film as novel Cu diffusion barrier

Choi, B. H. / Lee, J. H. / Lee, H. K. / Kim, J. H.

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Check availability in my library

Order at Subito €

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Document information

Title:

Effect of interface layer on growth behavior of atomic-layer-deposited Ir thin film as novel Cu diffusion barrier

Contributors:

Choi, B. H. (author) / Lee, J. H. (author) / Lee, H. K. (author) / Kim, J. H. (author)

Published in:

APPLIED SURFACE SCIENCE ; 257 ; 9654-9660

Publication date:

2011-01-01

Size:

7 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

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