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    Analysis of Chip Damage Risk in Thermosonic Wire Bonding

    New search for: Dresbach, C.
    New search for: Lorenz, G.
    New search for: Petzold, M.
    New search for: Altenbach, H.
    New search for: Ochsner, A.
    New search for: da Silva, L.F.M.
    New search for: Altenbach, H.

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    Analysis of Chip Damage Risk in Thermosonic Wire Bonding

    New search for: Dresbach, C.
    New search for: Lorenz, G.
    New search for: Petzold, M.
    New search for: Altenbach, H.
    New search for: Ochsner, A.
    New search for: da Silva, L.F.M.
    New search for: Altenbach, H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Analysis of Chip Damage Risk in Thermosonic Wire Bonding

    New search for: Dresbach, C.
    New search for: Lorenz, G.
    New search for: Petzold, M.
    New search for: Altenbach, H.
    New search for: Ochsner, A.
    New search for: da Silva, L.F.M.
    New search for: Altenbach, H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Analysis of Chip Damage Risk in Thermosonic Wire Bonding

    Contributors:

    Dresbach, C. (author) / Lorenz, G. (author) / Petzold, M. (author) / Altenbach, H. (author) / Ochsner, A. / da Silva, L.F.M. / Altenbach, H.

    Published in:

    Advanced Computational Engineering and Experimenting ; 75-80

    KEY ENGINEERING MATERIALS ; 478

    Publication date:

    2011-01-01

    Size:

    6 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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