Finite Element Analysis on Thermosonic Ball Bonding Process of MEMS Chip: Fid-Bau Portal

Finite Element Analysis on Thermosonic Ball Bonding Process of MEMS Chip

Wang, D.R. / Liu, M.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Finite Element Analysis on Thermosonic Ball Bonding Process of MEMS Chip

Wang, D.R. / Liu, M.

Finite Element Analysis on Thermosonic Ball Bonding Process of MEMS Chip

Wang, D.R. / Liu, M.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Document information

Title:

Finite Element Analysis on Thermosonic Ball Bonding Process of MEMS Chip

Contributors:

Wang, D.R. (author) / Liu, M. (author) / Tang, F.

Published in:

MICRO-NANO TECHNOLOGY XV ; 1153-1158

KEY ENGINEERING MATERIALS ; 609/610

Publication date:

2014-01-01

Size:

6 pages

ISSN:

1013-9826

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

Dresbach, C. / Lorenz, G. / Petzold, M. et al. | British Library Online Contents | 2011

Characteristics of Thermosonic Anisotropic Conductive Adhesives (ACFs) Flip-Chip Bonding

Kim, J.-M. / Song, Y. / Cho, M. et al. | British Library Online Contents | 2010

Properties Investigation on Chip-on-Film (COF) Thermosonic Bonding Using Anisotropic Conductive Films (ACFs)

Jeong, J.S. / Yim, B.-S. / Oh, S.H. et al. | British Library Online Contents | 2012

Tail Breaking Force in Thermosonic Wire Bonding with Novel Bonding Wires

Lee, J. / Mayer, M. / Zhou, Y. et al. | British Library Online Contents | 2008

Features of Machine Variables in Thermosonic Flip Chip

Li, J. H. / Han, L. / Duan, J. A. et al. | British Library Online Contents | 2007