Effect of Pd Addition in ENIG Surface Finish on Drop Reliability of Sn-Ag-Cu Solder Joint: Fid-Bau Portal

Effect of Pd Addition in ENIG Surface Finish on Drop Reliability of Sn-Ag-Cu Solder Joint

Ha, S.-S. / Park, J. / Jung, S.-B.

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Effect of Pd Addition in ENIG Surface Finish on Drop Reliability of Sn-Ag-Cu Solder Joint

Ha, S.-S. / Park, J. / Jung, S.-B.

Effect of Pd Addition in ENIG Surface Finish on Drop Reliability of Sn-Ag-Cu Solder Joint

Ha, S.-S. / Park, J. / Jung, S.-B.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Effect of Pd Addition in ENIG Surface Finish on Drop Reliability of Sn-Ag-Cu Solder Joint

Contributors:

Ha, S.-S. (author) / Park, J. (author) / Jung, S.-B. (author)

Published in:

MATERIALS TRANSACTIONS ; 52 ; 1553-1559

Publication date:

2011-01-01

Size:

7 pages

ISSN:

1345-9678

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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