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Effect of Pd Addition in ENIG Surface Finish on Drop Reliability of Sn-Ag-Cu Solder Joint
Effect of Pd Addition in ENIG Surface Finish on Drop Reliability of Sn-Ag-Cu Solder Joint
Effect of Pd Addition in ENIG Surface Finish on Drop Reliability of Sn-Ag-Cu Solder Joint
Ha, S.-S. (author) / Park, J. (author) / Jung, S.-B. (author)
MATERIALS TRANSACTIONS ; 52 ; 1553-1559
2011-01-01
7 pages
Article (Journal)
English
DDC:
620.11
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