A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Dynamic Filling Characteristics of a Capillary Driven Underfill Process in Flip-Chip Packaging
Dynamic Filling Characteristics of a Capillary Driven Underfill Process in Flip-Chip Packaging
Dynamic Filling Characteristics of a Capillary Driven Underfill Process in Flip-Chip Packaging
Lee, S.H. (author) / Lee, H.J. (author) / Kim, J.-M. (author) / Shin, Y.E. (author)
MATERIALS TRANSACTIONS ; 52 ; 1998-2003
2011-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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