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A platform for research: civil engineering, architecture and urbanism
The Study of Underfill Epoxy Hardness in Reducing Curing Process Time for Flip Chip Packaging
The Study of Underfill Epoxy Hardness in Reducing Curing Process Time for Flip Chip Packaging
The Study of Underfill Epoxy Hardness in Reducing Curing Process Time for Flip Chip Packaging
Kornain, Z. (author) / Jalar, A. (author) / Rasid, R. (author) / Abdullah, S. (author) / Ariffin, A.K. / Abdullah, S. / Ali, A. / Muchtar, A. / Ghazali, M.J. / Sajuri, Z.
Fracture and Strength of Solids VII Part 2 ; 1193-1198
KEY ENGINEERING MATERIALS ; 462/463
2011-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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