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A platform for research: civil engineering, architecture and urbanism
A two-dimensional simulation model for the molded underfill process in flip chip packaging
A two-dimensional simulation model for the molded underfill process in flip chip packaging
A two-dimensional simulation model for the molded underfill process in flip chip packaging
Guo, X. R. (author) / Young, W. B. (author)
JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY ; 29 ; 2967-2974
2015-01-01
8 pages
Article (Journal)
English
DDC:
621
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