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Z-axis Interconnections for Next Generation Packaging
Z-axis Interconnections for Next Generation Packaging
Z-axis Interconnections for Next Generation Packaging
Das, R.N. (author) / Egitto, F.D. (author) / Lauffer, J.M. (author) / Antesberger, T. (author) / Markovich, V.R. (author)
ADVANCING MICROELECTRONICS ; 38 ; 12-19
2011-01-01
8 pages
Article (Journal)
English
DDC:
621.381
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