Flip Chip Interconnect: Examining the Infrastructure

Vardaman, E.J. / Matthew, L. | British Library Online Contents | 2014

Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu-xNi Flip Chip Interconnects (Express Regular Article)

Terashima, S. / Tanaka, M. | British Library Online Contents | 2004

Electromigration Effects upon Interfacial Reactions in Flip-Chip Solder Joints

Chen, S.-w. / Lin, S.-k. / Jao, J.-m. | British Library Online Contents | 2004

Improvement on Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu Flip Chip Interconnects by Nickel Addition (Express Regular Article)

Terashima, S. / Kariya, Y. / Tanaka, M. | British Library Online Contents | 2004

Interconnect Design and Thermal Stress/Strain Analysis of Flip Chip Packaging

Liu, C. M. / Lee, C. C. / Ku, H. T. et al. | British Library Online Contents | 2006