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Electromigration Effects upon Interfacial Reactions in Flip-Chip Solder Joints

Chen, S.-w. / Lin, S.-k. / Jao, J.-m.

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Electromigration Effects upon Interfacial Reactions in Flip-Chip Solder Joints

Chen, S.-w. / Lin, S.-k. / Jao, J.-m.

Electromigration Effects upon Interfacial Reactions in Flip-Chip Solder Joints

Chen, S.-w. / Lin, S.-k. / Jao, J.-m.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Electromigration Effects upon Interfacial Reactions in Flip-Chip Solder Joints

Contributors:

Chen, S.-w. (author) / Lin, S.-k. (author) / Jao, J.-m. (author)

Published in:

MATERIALS TRANSACTIONS ; 45 ; 661-665

Publication date:

2004-01-01

Size:

5 pages

ISSN:

1345-9678

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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