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Ultrathin Cr added Ru film as a seedless Cu diffusion barrier for advanced Cu interconnects

Hsu, K. C. / Perng, D. C. / Yeh, J. B. / Wang, Y. C.

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Ultrathin Cr added Ru film as a seedless Cu diffusion barrier for advanced Cu interconnects

Hsu, K. C. / Perng, D. C. / Yeh, J. B. / Wang, Y. C.

Ultrathin Cr added Ru film as a seedless Cu diffusion barrier for advanced Cu interconnects

Hsu, K. C. / Perng, D. C. / Yeh, J. B. / Wang, Y. C.

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Check availability in my library

Order at Subito €

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Document information

Title:

Ultrathin Cr added Ru film as a seedless Cu diffusion barrier for advanced Cu interconnects

Contributors:

Hsu, K. C. (author) / Perng, D. C. (author) / Yeh, J. B. (author) / Wang, Y. C. (author)

Published in:

APPLIED SURFACE SCIENCE ; 258 ; 7225-7230

Publication date:

2012-01-01

Size:

6 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

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