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Ru/WCoCN as a seedless Cu barrier system for advanced Cu metallization

Perng, D. C. / Yeh, J. B. / Hsu, K. C.

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Ru/WCoCN as a seedless Cu barrier system for advanced Cu metallization

Perng, D. C. / Yeh, J. B. / Hsu, K. C.

Ru/WCoCN as a seedless Cu barrier system for advanced Cu metallization

Perng, D. C. / Yeh, J. B. / Hsu, K. C.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Ru/WCoCN as a seedless Cu barrier system for advanced Cu metallization

Contributors:

Perng, D. C. (author) / Yeh, J. B. (author) / Hsu, K. C. (author)

Published in:

APPLIED SURFACE SCIENCE ; 256 ; 688-692

Publication date:

2009-01-01

Size:

5 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

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