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Ultrathin amorphous Ni-Ti film as diffusion barrier for Cu interconnection

Liu, B. T. / Yang, L. / Li, X. H. / Wang, K. M. / Guo, Z. / Chen, J. H. / Li, M. / Zhao, D. Y. / Zhao, Q. X. / Zhang, X. Y.

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Ultrathin amorphous Ni-Ti film as diffusion barrier for Cu interconnection

Liu, B. T. / Yang, L. / Li, X. H. / Wang, K. M. / Guo, Z. / Chen, J. H. / Li, M. / Zhao, D. Y. / Zhao, Q. X. / Zhang, X. Y.

Ultrathin amorphous Ni-Ti film as diffusion barrier for Cu interconnection

Liu, B. T. / Yang, L. / Li, X. H. / Wang, K. M. / Guo, Z. / Chen, J. H. / Li, M. / Zhao, D. Y. / Zhao, Q. X. / Zhang, X. Y.

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Document information

Title:

Ultrathin amorphous Ni-Ti film as diffusion barrier for Cu interconnection

Contributors:

Liu, B. T. (author) / Yang, L. (author) / Li, X. H. (author) / Wang, K. M. (author) / Guo, Z. (author) / Chen, J. H. (author) / Li, M. (author) / Zhao, D. Y. (author) / Zhao, Q. X. (author) / Zhang, X. Y. (author)

Published in:

APPLIED SURFACE SCIENCE ; 257 ; 2920-2922

Publication date:

2011-01-01

Size:

3 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

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