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    Influence of pulsed substrate bias on the structure and properties of Ti-Al-N films deposited by cathodic vacuum arc

    New search for: Zhang, G. P.
    New search for: Gao, G. J.
    New search for: Wang, X. Q.
    New search for: Lv, G. H.
    New search for: Zhou, L.
    New search for: Chen, H.
    New search for: Pang, H.
    New search for: Yang, S. Z.

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    Influence of pulsed substrate bias on the structure and properties of Ti-Al-N films deposited by cathodic vacuum arc

    New search for: Zhang, G. P.
    New search for: Gao, G. J.
    New search for: Wang, X. Q.
    New search for: Lv, G. H.
    New search for: Zhou, L.
    New search for: Chen, H.
    New search for: Pang, H.
    New search for: Yang, S. Z.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Influence of pulsed substrate bias on the structure and properties of Ti-Al-N films deposited by cathodic vacuum arc

    New search for: Zhang, G. P.
    New search for: Gao, G. J.
    New search for: Wang, X. Q.
    New search for: Lv, G. H.
    New search for: Zhou, L.
    New search for: Chen, H.
    New search for: Pang, H.
    New search for: Yang, S. Z.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Document information
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    Document information
    Title:

    Influence of pulsed substrate bias on the structure and properties of Ti-Al-N films deposited by cathodic vacuum arc

    Contributors:

    Zhang, G. P. (author) / Gao, G. J. (author) / Wang, X. Q. (author) / Lv, G. H. (author) / Zhou, L. (author) / Chen, H. (author) / Pang, H. (author) / Yang, S. Z. (author)

    Published in:

    APPLIED SURFACE SCIENCE ; 258 ; 7274-7279

    Publication date:

    2012-01-01

    Size:

    6 pages

    ISSN:

    0169-4332

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.35

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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