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Evaluation of the joint strength between Sn–3.0Ag–0.5Cu solders and Cu substrate at high strain rates

You, I. D. / Kim, H. K.

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Evaluation of the joint strength between Sn–3.0Ag–0.5Cu solders and Cu substrate at high strain rates

You, I. D. / Kim, H. K.

Evaluation of the joint strength between Sn–3.0Ag–0.5Cu solders and Cu substrate at high strain rates

You, I. D. / Kim, H. K.

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Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

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Document information

Title:

Evaluation of the joint strength between Sn–3.0Ag–0.5Cu solders and Cu substrate at high strain rates

Contributors:

You, I. D. (author) / Kim, H. K. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 556 ; 551-557

Publication date:

2012-01-01

Size:

7 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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