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    Wetting kinetics and wettability enhancement of Pd added electrolytic Ni surface with molten Sn–3.0Ag–0.5Cu solder

    New search for: Ho, C. Y.
    New search for: Duh, J. G.

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    Wetting kinetics and wettability enhancement of Pd added electrolytic Ni surface with molten Sn–3.0Ag–0.5Cu solder

    New search for: Ho, C. Y.
    New search for: Duh, J. G.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Wetting kinetics and wettability enhancement of Pd added electrolytic Ni surface with molten Sn–3.0Ag–0.5Cu solder

    New search for: Ho, C. Y.
    New search for: Duh, J. G.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Check availability in my library
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    Document information
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    Document information
    Title:

    Wetting kinetics and wettability enhancement of Pd added electrolytic Ni surface with molten Sn–3.0Ag–0.5Cu solder

    Contributors:

    Ho, C. Y. (author) / Duh, J. G. (author)

    Published in:

    MATERIALS LETTERS ; 92 ; 278-280

    Publication date:

    2013-01-01

    Size:

    3 pages

    ISSN:

    0167-577X

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1105 / 530

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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