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Basic Experiment on Atmospheric-Pressure Plasma Etching with Slit Aperture for High-Efficiency Dicing of SiC Wafer
Basic Experiment on Atmospheric-Pressure Plasma Etching with Slit Aperture for High-Efficiency Dicing of SiC Wafer
Basic Experiment on Atmospheric-Pressure Plasma Etching with Slit Aperture for High-Efficiency Dicing of SiC Wafer
Sano, Y. (author) / Nishikawa, H. (author) / Aida, K. (author) / Tangpatjaroen, C. (author) / Yamamura, K. (author) / Matsuyama, S. (author) / Yamauchi, K. (author) / Lebedev, A.A. / Davydov, S.Y. / Ivanov, P.A.
2013-01-01
4 pages
Article (Journal)
English
DDC:
620.11
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