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Back-Side Thinning of Silicon Carbide Wafer by Plasma Etching Using Atmospheric-Pressure Plasma
Back-Side Thinning of Silicon Carbide Wafer by Plasma Etching Using Atmospheric-Pressure Plasma
Back-Side Thinning of Silicon Carbide Wafer by Plasma Etching Using Atmospheric-Pressure Plasma
Sano, Y. (author) / Aida, K. (author) / Nishikawa, H. (author) / Yamamura, K. (author) / Matsuyama, S. (author) / Yamauchi, K. (author)
KEY ENGINEERING MATERIALS ; 516 ; 108-112
2012-01-01
5 pages
Article (Journal)
English
DDC:
620.11
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