A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Fracture Study of Ultrasonic Aluminum Wire Wedge Bonding on Copper Substrate with Mechanical Peeling-Off Method
Fracture Study of Ultrasonic Aluminum Wire Wedge Bonding on Copper Substrate with Mechanical Peeling-Off Method
Fracture Study of Ultrasonic Aluminum Wire Wedge Bonding on Copper Substrate with Mechanical Peeling-Off Method
Bang, H.S. (author) / Ji, H.J. (author) / Li, M.Y. (author) / Wang, C.Q. (author) / Lee, C. / Lee, J.-B. / Park, D.-H. / Na, S.-J.
2008-01-01
4 pages
Article (Journal)
English
DDC:
620.11
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