A platform for research: civil engineering, architecture and urbanism
Fracture Study of Ultrasonic Aluminum Wire Wedge Bonding on Copper Substrate with Mechanical Peeling-Off Method
Fracture Study of Ultrasonic Aluminum Wire Wedge Bonding on Copper Substrate with Mechanical Peeling-Off Method
Fracture Study of Ultrasonic Aluminum Wire Wedge Bonding on Copper Substrate with Mechanical Peeling-Off Method
Bang, H.S. (author) / Ji, H.J. (author) / Li, M.Y. (author) / Wang, C.Q. (author) / Lee, C. / Lee, J.-B. / Park, D.-H. / Na, S.-J.
2008-01-01
4 pages
Article (Journal)
English
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Irregular Characteristics of Bond Interface Formation in Ultrasonic Wire Wedge Bonding
British Library Online Contents | 2006
|Deformation Behavior of Thick Aluminum Wire during Ultrasonic Bonding
British Library Online Contents | 2013
|British Library Online Contents | 2007
|Wallboard with excellent mechanical property, good bonding effect and low peeling possibility
European Patent Office | 2015
|