Materials Issues in Copper Interconnections

Harper, J. M. E. / Colgan, E. G. / Hu, C.-K. et al. | British Library Online Contents | 1994

Effects of Cu and Ni additions to eutectic Pb-Sn solders on Au embrittlement of solder interconnections

Lee, J.-H. / Park, J.-H. / Lee, Y.-H. et al. | British Library Online Contents | 2001

Low dielectric constant materials and methods for interlayer dielectric films in ultralarge-scale integrated circuit multilevel interconnections

Homma, T. | British Library Online Contents | 1998

Effect of palladium on the hydrogen embrittlement of B-doped Ni~3Al

Yang, L. / McLellan, R. B. | British Library Online Contents | 1996

Carbon nanotube-based interconnections

Mittal, J. / Lin, K. L. | British Library Online Contents | 2017