Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Dissolutive wetting process and interfacial characteristic of molten Sn–17Bi–0.5Cu alloy on copper substrate

    New search for: Xu, B. S.
    New search for: Zang, L. K.
    New search for: Yuan, Z. F.
    New search for: Wu, Y.
    New search for: Zhou, Z.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Dissolutive wetting process and interfacial characteristic of molten Sn–17Bi–0.5Cu alloy on copper substrate

    New search for: Xu, B. S.
    New search for: Zang, L. K.
    New search for: Yuan, Z. F.
    New search for: Wu, Y.
    New search for: Zhou, Z.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Dissolutive wetting process and interfacial characteristic of molten Sn–17Bi–0.5Cu alloy on copper substrate

    New search for: Xu, B. S.
    New search for: Zang, L. K.
    New search for: Yuan, Z. F.
    New search for: Wu, Y.
    New search for: Zhou, Z.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Dissolutive wetting process and interfacial characteristic of molten Sn–17Bi–0.5Cu alloy on copper substrate

    Contributors:

    Xu, B. S. (author) / Zang, L. K. (author) / Yuan, Z. F. (author) / Wu, Y. (author) / Zhou, Z. (author)

    Published in:

    RARE METALS -BEIJING- ENGLISH EDITION ; 32 ; 537-543

    Publication date:

    2013-01-01

    Size:

    7 pages

    ISSN:

    1001-0521

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  669

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Dissolutive wetting of Si by molten Cu

    Protsenko, P. / Kozlova, O. / Voytovych, R. et al. | British Library Online Contents | 2008

    Modeling and experiments in dissolutive wetting: a review

    Singler, T. J. / Su, S. / Yin, L. et al. | British Library Online Contents | 2012

    Reactive wetting in metal/metal systems: Dissolutive versus compound-forming systems

    Yin, L. / Chauhan, A. / Singler, T. J. | British Library Online Contents | 2008

    Wetting process and interfacial characteristic of Sn-3.0Ag-0.5Cu on different substrates at temperatures ranging from 503K to 673K

    Zang, L. / Yuan, Z. / Xu, H. et al. | British Library Online Contents | 2011

    Wetting kinetics and wettability enhancement of Pd added electrolytic Ni surface with molten Sn–3.0Ag–0.5Cu solder

    Ho, C. Y. / Duh, J. G. | British Library Online Contents | 2013

    Back to top