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Wetting process and interfacial characteristic of Sn-3.0Ag-0.5Cu on different substrates at temperatures ranging from 503K to 673K
Wetting process and interfacial characteristic of Sn-3.0Ag-0.5Cu on different substrates at temperatures ranging from 503K to 673K
Wetting process and interfacial characteristic of Sn-3.0Ag-0.5Cu on different substrates at temperatures ranging from 503K to 673K
APPLIED SURFACE SCIENCE ; 257 ; 4877-4884
2011-01-01
8 pages
Article (Journal)
English
DDC:
621.35
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