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    Fatigue life prediction of solder joints with consideration of frequency, temperature and cracking energy density

    New search for: Lee, J. H.
    New search for: Jeong, H. Y.

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    Fatigue life prediction of solder joints with consideration of frequency, temperature and cracking energy density

    New search for: Lee, J. H.
    New search for: Jeong, H. Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Fatigue life prediction of solder joints with consideration of frequency, temperature and cracking energy density

    New search for: Lee, J. H.
    New search for: Jeong, H. Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Fatigue life prediction of solder joints with consideration of frequency, temperature and cracking energy density

    Contributors:

    Lee, J. H. (author) / Jeong, H. Y. (author)

    Published in:

    INTERNATIONAL JOURNAL OF FATIGUE ; 61 ; 264-270

    Publication date:

    2014-01-01

    Size:

    7 pages

    ISSN:

    0142-1123

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1126

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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