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Fatigue life prediction of solder joints with consideration of frequency, temperature and cracking energy density
Fatigue life prediction of solder joints with consideration of frequency, temperature and cracking energy density
Fatigue life prediction of solder joints with consideration of frequency, temperature and cracking energy density
Lee, J. H. (Autor:in) / Jeong, H. Y. (Autor:in)
INTERNATIONAL JOURNAL OF FATIGUE ; 61 ; 264-270
01.01.2014
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1126
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