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Electromigration in lead-free solder joints under high-frequency pulse current: An experimental study

Yao, W. / Basaran, C.

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Electromigration in lead-free solder joints under high-frequency pulse current: An experimental study

Yao, W. / Basaran, C.

Electromigration in lead-free solder joints under high-frequency pulse current: An experimental study

Yao, W. / Basaran, C.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Electromigration in lead-free solder joints under high-frequency pulse current: An experimental study

Contributors:

Yao, W. (author) / Basaran, C. (author)

Published in:

INTERNATIONAL JOURNAL OF DAMAGE MECHANICS ; 22 ; 1127-1143

Publication date:

2013-01-01

Size:

17 pages

ISSN:

1056-7895

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1

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