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Electromigration in lead-free solder joints under high-frequency pulse current: An experimental study

Yao, W. / Basaran, C.

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Electromigration in lead-free solder joints under high-frequency pulse current: An experimental study

Yao, W. / Basaran, C.

Electromigration in lead-free solder joints under high-frequency pulse current: An experimental study

Yao, W. / Basaran, C.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

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Dokumentinformationen

Titel:

Electromigration in lead-free solder joints under high-frequency pulse current: An experimental study

Beteiligte:

Yao, W. (Autor:in) / Basaran, C. (Autor:in)

Erschienen in:

INTERNATIONAL JOURNAL OF DAMAGE MECHANICS ; 22 ; 1127-1143

Erscheinungsdatum:

01.01.2013

Format / Umfang:

17 pages

ISSN:

1056-7895

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.1

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Yao, W. / Basaran, C. | British Library Online Contents | 2014

Evolution of micro solder joints under electromigration and elastic field

Kim, D. | British Library Online Contents | 2009

Electromigration and thermomigration behavior of flip chip solder joints in high current density packages

Yang, D. | British Library Online Contents | 2008

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