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Damage mechanics of electromigration and thermomigration in lead-free solder alloys under alternating current: An experimental study
Damage mechanics of electromigration and thermomigration in lead-free solder alloys under alternating current: An experimental study
Damage mechanics of electromigration and thermomigration in lead-free solder alloys under alternating current: An experimental study
Yao, W. (author) / Basaran, C. (author)
INTERNATIONAL JOURNAL OF DAMAGE MECHANICS ; 23 ; 203-221
2014-01-01
19 pages
Article (Journal)
English
DDC:
620.1
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