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Thinning of a Two-Inch Silicon Carbide Wafer by Plasma Chemical Vaporization Machining Using a Slit Electrode
Thinning of a Two-Inch Silicon Carbide Wafer by Plasma Chemical Vaporization Machining Using a Slit Electrode
Thinning of a Two-Inch Silicon Carbide Wafer by Plasma Chemical Vaporization Machining Using a Slit Electrode
Okada, Y. (author) / Nishikawa, H. (author) / Sano, Y. (author) / Yamamura, K. (author) / Yamauchi, K. (author) / Okumura, H. / Harima, H. / Kimoto, T. / Yoshimoto, M. / Watanabe, H.
2014-01-01
4 pages
Article (Journal)
English
DDC:
620.11
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