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Thinning of SiC Wafer by Plasma Chemical Vaporization Machining

Sano, Y. / Kato, T. / Hori, T. / Yamamura, K. / Mimura, H. / Katsuyama, Y. / Yamauchi, K.

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Thinning of SiC Wafer by Plasma Chemical Vaporization Machining

Sano, Y. / Kato, T. / Hori, T. / Yamamura, K. / Mimura, H. / Katsuyama, Y. / Yamauchi, K.

Thinning of SiC Wafer by Plasma Chemical Vaporization Machining

Sano, Y. / Kato, T. / Hori, T. / Yamamura, K. / Mimura, H. / Katsuyama, Y. / Yamauchi, K.

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Title:

Thinning of SiC Wafer by Plasma Chemical Vaporization Machining

Contributors:

Sano, Y. (author) / Kato, T. (author) / Hori, T. (author) / Yamamura, K. (author) / Mimura, H. (author) / Katsuyama, Y. (author) / Yamauchi, K. (author) / Bauer, A.J. / Friedrichs, P. / Krieger, M.

Published in:

Silicon Carbide and Related Materials 2009 ; 857-860

MATERIALS SCIENCE FORUM ; 645/648

Publication date:

2010-01-01

Size:

4 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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