Thinning of 2-Inch SiC Wafer by Plasma Chemical Vaporization Machining Using Cylindrical Rotary Electrode: Fid-Bau Portal

Thinning of 2-Inch SiC Wafer by Plasma Chemical Vaporization Machining Using Cylindrical Rotary Electrode

Sano, Y. / Kato, T. / Aida, K. / Yamamura, K. / Mimura, H. / Matsuyama, S. / Yamauchi, K.

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Thinning of 2-Inch SiC Wafer by Plasma Chemical Vaporization Machining Using Cylindrical Rotary Electrode

Sano, Y. / Kato, T. / Aida, K. / Yamamura, K. / Mimura, H. / Matsuyama, S. / Yamauchi, K.

Thinning of 2-Inch SiC Wafer by Plasma Chemical Vaporization Machining Using Cylindrical Rotary Electrode

Sano, Y. / Kato, T. / Aida, K. / Yamamura, K. / Mimura, H. / Matsuyama, S. / Yamauchi, K.

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Title:

Thinning of 2-Inch SiC Wafer by Plasma Chemical Vaporization Machining Using Cylindrical Rotary Electrode

Contributors:

Sano, Y. (author) / Kato, T. (author) / Aida, K. (author) / Yamamura, K. (author) / Mimura, H. (author) / Matsuyama, S. (author) / Yamauchi, K. (author) / Monakhov, E.V. / Hornos, T. / Svensson, B.G.

Published in:

Silicon Carbide and Related Materials 2010 ; 481-484

MATERIALS SCIENCE FORUM ; 679/680

Publication date:

2011-01-01

Size:

4 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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