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    High-Strength Pressure-Free Bonding Using Cu and Ni-Sn Nanoparticles

    New search for: Watanabe, R.
    New search for: Ishizaki, T.

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    High-Strength Pressure-Free Bonding Using Cu and Ni-Sn Nanoparticles

    New search for: Watanabe, R.
    New search for: Ishizaki, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    High-Strength Pressure-Free Bonding Using Cu and Ni-Sn Nanoparticles

    New search for: Watanabe, R.
    New search for: Ishizaki, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    High-Strength Pressure-Free Bonding Using Cu and Ni-Sn Nanoparticles

    Contributors:

    Watanabe, R. (author) / Ishizaki, T. (author)

    Published in:

    PARTICLE AND PARTICLE SYSTEMS CHARACTERIZATION ; 31 ; 699-705

    Publication date:

    2014-01-01

    Size:

    7 pages

    ISSN:

    0934-0866

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.43

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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