Influence of Bonding Condition on Bonding Process Using Ag Metallo-Organic Nanoparticles for High Temperature Lead-Free Packaging: Fid-Bau Portal

Influence of Bonding Condition on Bonding Process Using Ag Metallo-Organic Nanoparticles for High Temperature Lead-Free Packaging

Ide, E. / Hirose, A. / Kobayashi, K. F.

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Influence of Bonding Condition on Bonding Process Using Ag Metallo-Organic Nanoparticles for High Temperature Lead-Free Packaging

Ide, E. / Hirose, A. / Kobayashi, K. F.

Influence of Bonding Condition on Bonding Process Using Ag Metallo-Organic Nanoparticles for High Temperature Lead-Free Packaging

Ide, E. / Hirose, A. / Kobayashi, K. F.

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Check availability in my library

Order at Subito €

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Document information

Title:

Influence of Bonding Condition on Bonding Process Using Ag Metallo-Organic Nanoparticles for High Temperature Lead-Free Packaging

Contributors:

Ide, E. (author) / Hirose, A. (author) / Kobayashi, K. F. (author)

Published in:

Present Status of the Research on Ordered Alloys and the Application to Magnetic Devices ; 211-217

MATERIALS TRANSACTIONS ; 47

Publication date:

2006-01-01

Size:

7 pages

ISSN:

1345-9678

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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