A platform for research: civil engineering, architecture and urbanism
Effect of rare earth Ce on the fatigue life of SnAgCu solder joints in WLCSP device using FEM and experiments
Effect of rare earth Ce on the fatigue life of SnAgCu solder joints in WLCSP device using FEM and experiments
Effect of rare earth Ce on the fatigue life of SnAgCu solder joints in WLCSP device using FEM and experiments
Zhang, L. (author) / Han, J. g. (author) / Guo, Y. h. (author) / He, C. w. (author)
MATERIALS SCIENCE AND ENGINEERING A ; 611 ; 219-224
2014-01-01
6 pages
Article (Journal)
English
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
British Library Online Contents | 2014
|Fatigue fracture of SnAgCu solder joints by microstructural modeling
British Library Online Contents | 2008
|Recrystallization behaviour of SnAgCu solder joints
British Library Online Contents | 2008
|Effect of RE on Creep Rupture Life of SnAgCu Solder Joints
British Library Online Contents | 2011
|British Library Online Contents | 2007
|