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    Effect of RE on Creep Rupture Life of SnAgCu Solder Joints

    New search for: Wang, Y.L.
    New search for: Dong, G.H.
    New search for: Li, C.Y.
    New search for: Wu, Z.W.
    New search for: Sun, J.
    New search for: Li, C.
    New search for: Jiang, C.
    New search for: Zhong, Z.
    New search for: Zhou, Y.

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    Effect of RE on Creep Rupture Life of SnAgCu Solder Joints

    New search for: Wang, Y.L.
    New search for: Dong, G.H.
    New search for: Li, C.Y.
    New search for: Wu, Z.W.
    New search for: Sun, J.
    New search for: Li, C.
    New search for: Jiang, C.
    New search for: Zhong, Z.
    New search for: Zhou, Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of RE on Creep Rupture Life of SnAgCu Solder Joints

    New search for: Wang, Y.L.
    New search for: Dong, G.H.
    New search for: Li, C.Y.
    New search for: Wu, Z.W.
    New search for: Sun, J.
    New search for: Li, C.
    New search for: Jiang, C.
    New search for: Zhong, Z.
    New search for: Zhou, Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Effect of RE on Creep Rupture Life of SnAgCu Solder Joints

    Contributors:

    Wang, Y.L. (author) / Dong, G.H. (author) / Li, C.Y. (author) / Wu, Z.W. (author) / Sun, J. (author) / Li, C. / Jiang, C. / Zhong, Z. / Zhou, Y.

    Published in:

    Functional and Electronic Materials ; 39-43

    MATERIALS SCIENCE FORUM ; 687

    Publication date:

    2011-01-01

    Size:

    5 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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