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    Deformation and fracture behaviour of electroplated Sn–Bi/Cu solder joints

    New search for: Goh, Y.
    New search for: Haseeb, A. S.
    New search for: Liew, H. L.
    New search for: Sabri, M. F.

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    Deformation and fracture behaviour of electroplated Sn–Bi/Cu solder joints

    New search for: Goh, Y.
    New search for: Haseeb, A. S.
    New search for: Liew, H. L.
    New search for: Sabri, M. F.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Deformation and fracture behaviour of electroplated Sn–Bi/Cu solder joints

    New search for: Goh, Y.
    New search for: Haseeb, A. S.
    New search for: Liew, H. L.
    New search for: Sabri, M. F.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Deformation and fracture behaviour of electroplated Sn–Bi/Cu solder joints

    Contributors:

    Goh, Y. (author) / Haseeb, A. S. (author) / Liew, H. L. (author) / Sabri, M. F. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE ; 50 ; 4258-4269

    Publication date:

    2015-01-01

    Size:

    12 pages

    ISSN:

    0022-2461

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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