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Thin film metallization by supersonic spraying of copper and nickel nanoparticles on a silicon substrate

Lee, J. G. / Kim, D. Y. / Kang, B. / Kim, D. / Al-Deyab, S. S. / James, S. C. / Yoon, S. S.

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Thin film metallization by supersonic spraying of copper and nickel nanoparticles on a silicon substrate

Lee, J. G. / Kim, D. Y. / Kang, B. / Kim, D. / Al-Deyab, S. S. / James, S. C. / Yoon, S. S.

Thin film metallization by supersonic spraying of copper and nickel nanoparticles on a silicon substrate

Lee, J. G. / Kim, D. Y. / Kang, B. / Kim, D. / Al-Deyab, S. S. / James, S. C. / Yoon, S. S.

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Document information

Title:

Thin film metallization by supersonic spraying of copper and nickel nanoparticles on a silicon substrate

Contributors:

Lee, J. G. (author) / Kim, D. Y. (author) / Kang, B. (author) / Kim, D. (author) / Al-Deyab, S. S. (author) / James, S. C. (author) / Yoon, S. S. (author)

Published in:

COMPUTATIONAL MATERIALS SCIENCE ; 108 ; 114-120

Publication date:

2015-01-01

Size:

7 pages

ISSN:

0927-0256

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1 / 510

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