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Nickel silicon thin film as barrier in under-bump-metallization by magnetron sputtering deposition for Pb-free chip packaging
Nickel silicon thin film as barrier in under-bump-metallization by magnetron sputtering deposition for Pb-free chip packaging
Nickel silicon thin film as barrier in under-bump-metallization by magnetron sputtering deposition for Pb-free chip packaging
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 20 ; 2622-2626
2005-01-01
5 pages
Article (Journal)
English
DDC:
620.11
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