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Ultrathin Al2O3 ceramic substrate metallization copper cladding and densification process
The invention belongs to the technical field of ceramic substrate metallization, and particularly relates to an ultrathin Al2O3 ceramic substrate surface metallization method and a porous copper layer pulse electroplating densification method. The process comprises the following steps of: deoiling and drying the surface of an ultrathin ceramic substrate by adopting an ultrasonic cleaning machine, preparing an organic carrier and CuO slurry, coating a copper oxide slurry layer by adopting a coating or silk-screen printing process, drying, putting the dried substrate into a furnace, and sequentially carrying out glue discharging, sintering and reduction processes; and preparing an electroplating solution, performing pulse electroplating densification by using an electroplating device, taking out the ceramic substrate after electroplating is completed, cleaning the surface electroplating solution by using deionized water, and then soaking and cleaning by using alcohol. According to the technology, the vacancy of an ultrathin ceramic substrate metallization technology is filled, the metallization technological process is simple, the obtained metal copper layer is not prone to oxidation and high in bonding strength, the defect that a copper layer obtained through a CuO sintering reduction copper cladding method is high in porosity is overcome through the electroplating densification technology, the density of the metal layer is improved, and the quality of the copper layer is optimized. The method has the advantages of low process temperature, wide process window, low precision requirements on temperature, time and electroplating parameters, low requirements on production equipment and low process cost.
本发明属于陶瓷基板金属化技术领域，具体涉及到一种超薄Al2O3陶瓷基板表面金属化的方法和一种多孔铜层脉冲电镀致密化的方法。其工艺过程包括以下几个步骤：采用超声清洗机对超薄陶瓷基板表面进行除油并烘干，制备有机载体与CuO浆料，采用涂布或丝网印刷工艺涂覆氧化铜浆料层并烘干，将烘干后的基板放入炉子中依次进行排胶、烧结和还原工艺；配制电镀液，使用电镀装置进行脉冲电镀致密化，完成电镀后取出陶瓷基板，用去离子水清洗表面镀液，再用酒精浸泡清洗。该工艺填补了超薄陶瓷基板金属化工艺的空缺，且金属化工艺流程简单，获得的金属铜层不易氧化，结合强度高，并且电镀致密化工艺弥补了CuO烧结还原敷铜法所得到铜层孔隙率高的缺陷，提高了金属层的致密度，优化铜层质量。本发明的工艺温度低，工艺窗口宽，对温度、时间、电镀参数的精度要求不高，对生产设备要求低，工艺成本低。
Ultrathin Al2O3 ceramic substrate metallization copper cladding and densification process
The invention belongs to the technical field of ceramic substrate metallization, and particularly relates to an ultrathin Al2O3 ceramic substrate surface metallization method and a porous copper layer pulse electroplating densification method. The process comprises the following steps of: deoiling and drying the surface of an ultrathin ceramic substrate by adopting an ultrasonic cleaning machine, preparing an organic carrier and CuO slurry, coating a copper oxide slurry layer by adopting a coating or silk-screen printing process, drying, putting the dried substrate into a furnace, and sequentially carrying out glue discharging, sintering and reduction processes; and preparing an electroplating solution, performing pulse electroplating densification by using an electroplating device, taking out the ceramic substrate after electroplating is completed, cleaning the surface electroplating solution by using deionized water, and then soaking and cleaning by using alcohol. According to the technology, the vacancy of an ultrathin ceramic substrate metallization technology is filled, the metallization technological process is simple, the obtained metal copper layer is not prone to oxidation and high in bonding strength, the defect that a copper layer obtained through a CuO sintering reduction copper cladding method is high in porosity is overcome through the electroplating densification technology, the density of the metal layer is improved, and the quality of the copper layer is optimized. The method has the advantages of low process temperature, wide process window, low precision requirements on temperature, time and electroplating parameters, low requirements on production equipment and low process cost.
本发明属于陶瓷基板金属化技术领域，具体涉及到一种超薄Al2O3陶瓷基板表面金属化的方法和一种多孔铜层脉冲电镀致密化的方法。其工艺过程包括以下几个步骤：采用超声清洗机对超薄陶瓷基板表面进行除油并烘干，制备有机载体与CuO浆料，采用涂布或丝网印刷工艺涂覆氧化铜浆料层并烘干，将烘干后的基板放入炉子中依次进行排胶、烧结和还原工艺；配制电镀液，使用电镀装置进行脉冲电镀致密化，完成电镀后取出陶瓷基板，用去离子水清洗表面镀液，再用酒精浸泡清洗。该工艺填补了超薄陶瓷基板金属化工艺的空缺，且金属化工艺流程简单，获得的金属铜层不易氧化，结合强度高，并且电镀致密化工艺弥补了CuO烧结还原敷铜法所得到铜层孔隙率高的缺陷，提高了金属层的致密度，优化铜层质量。本发明的工艺温度低，工艺窗口宽，对温度、时间、电镀参数的精度要求不高，对生产设备要求低，工艺成本低。
Ultrathin Al2O3 ceramic substrate metallization copper cladding and densification process
一种超薄Al2O3陶瓷基板金属化敷铜及致密化工艺
XU XINYA (author) / HU YUNJIA (author) / XIE JIHUA (author) / DAI RUIFENG (author)
2024-11-12
Patent
Electronic Resource
Chinese
Ultrathin Diffusion Barriers/Liners for Gigascale Copper Metallization
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