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Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux doping

Bashir, M. N. / Haseeb, A. S. / Rahman, A. Z. / Fazal, M. A. / Kao, C. R.

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Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux doping

Bashir, M. N. / Haseeb, A. S. / Rahman, A. Z. / Fazal, M. A. / Kao, C. R.

Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux doping

Bashir, M. N. / Haseeb, A. S. / Rahman, A. Z. / Fazal, M. A. / Kao, C. R.

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Document information

Title:

Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux doping

Contributors:

Bashir, M. N. (author) / Haseeb, A. S. (author) / Rahman, A. Z. (author) / Fazal, M. A. (author) / Kao, C. R. (author)

Published in:

JOURNAL OF MATERIALS SCIENCE ; 50 ; 6748-6756

Publication date:

2015-01-01

Size:

9 pages

ISSN:

0022-2461

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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